ISO 7792-2-1988 塑料.聚对苯二甲酸亚苯基酯.第1部分:试样的制备和性质的测定
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来源:标准资料网
【英文标准名称】:Plastics;polyalkyleneterephthalates;part2:preparationoftestspecimensanddeterminationofproperties
【原文标准名称】:塑料.聚对苯二甲酸亚苯基酯.第1部分:试样的制备和性质的测定
【标准号】:ISO7792-2-1988
【标准状态】:作废
【国别】:国际
【发布日期】:1988-12
【实施或试行日期】:1988-12-01
【发布单位】:国际标准化组织(ISO)
【起草单位】:ISO/TC61
【标准类型】:()
【标准水平】:()
【中文主题词】:塑料;试验;热塑性聚合物;热塑性树脂;对苯二甲酸酯;聚对苯二甲酸亚苯基酯;试样制备;烯烃
【英文主题词】:testing;thermoplasticpolymers;terephthalates;alkenes;plastics;specimenpreparation;tests;polyalkyleneterephthalate;thermoplasticresins
【摘要】:
【中国标准分类号】:G31
【国际标准分类号】:6850
【页数】:3P;A4
【正文语种】:英语
【英文标准名称】:Heatexchangers-Guidelinestoprepareinstallation,operatingandmaintenanceinstructionsrequiredtomaintaintheperformanceofeachtypeofheatexchanger;GermanversionEN307:1998
【原文标准名称】:热交换器.维护各种类型热交换器性能所需要的安装、操作及维修说明书的编制指南
【标准号】:EN307-1998
【标准状态】:现行
【国别】:
【发布日期】:1998-12
【实施或试行日期】:
【发布单位】:欧洲标准学会(EN)
【起草单位】:
【标准类型】:()
【标准水平】:()
【中文主题词】:热环境系统;架设(施工作业);定义;安装细则;操作;维修;安装;文献工作;使用说明;装配;说明书;维修说明书;性能;组装指导说明;使用维修手册;操作说明书;热传递;热交换器;热力学性质
【英文主题词】:Assemblyinstructions;Definition;Definitions;Erecting(constructionoperation);Heatexchangers;Heattransfer;Installation;Installations;Instructions;Instructionsforuse;Maintenance;Maintenanceinstructions;Mountinginstructions;Operatinginstructions;Operation;Operationalinstructions;Performance;Properties;Servicemanual;Thermalenvironmentsystems;Thermodynamicproperties
【摘要】:
【中国标准分类号】:J75
【国际标准分类号】:27_060_30
【页数】:10P.;A4
【正文语种】:英语
Product Code:SAE ARP1332
Title:Wave Soldering Procedure
Issuing Committee:Ams B Finishes Processes And Fluids Committee
Scope: The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards.In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.
Rationale: The purpose of this recommended practice is to provide recommendations concerning the procedure for wave soldering.The detailed recommendations are based on manufacturing experience and laboratory experiments. The recommendations reflect those design practices and fabricating procedures which have been found to be most effective in producing functional electronic modules for critical communications or control systems. Electronic modules include assemblies, components, and printed circuit (PC) or printed wire (PW) boards.In the following text, references to printed circuit (PC) boards shall be construed to included printed wire (PW) boards.